1.Features
.Halogen-Free per EN14582 test method
.High transfer effi ciency through small apertures
(. 0.66AR)
.Eliminates hot and cold slump
.High oxidation resistance
.Wets well to oxidized BGA and pad surfaces
.Excellent soldering performance under high temperature
and long refl ow processes
.Clear, probe testable fl ux residue
.Backward compatible with Sn/Pb alloys
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2.Introduction
Indium8.9HF?is an air refl ow, no-clean solder paste
specifi cally formulated to accommodate the higher
processing temperatures required by the Sn/Ag/Cu,
Sn/Ag, and other alloy systems favored by the electronics
industry to replace conventional Pb- bearing solders.
Indium8.9HF offers unprecedented stencil print transfer
effi ciency to work in the broadest range of processes.
In addition, the high probe testability of Indium8.9HF
minimizes false failures in ICT.
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3.Alloys
Indium?Corporation manufactures low-oxide spherical powder
composed of a variety of Pb-Free alloys that cover a broad
range of melting temperatures. Type 4 and Type 3 powder
are standard offerings with SAC3 ?05 & SAC387 alloys. The
metal percent is the weight percent of the solder powder in
the solder paste and is dependant upon the powder type and
application. Standard product offerings are detailed in the
following table.

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