1.FEATURE
? Precise print definition with Type 6 and smaller alloypowder
? Excellent wetting/high shear strength
? Clear flux residue? Nitrogen reflow recommended
? Zero halogen? 8-hour stencil life


2.DESCRIPTION
AIM’s NC259FPA Ultrafine No Clean Solder Paste hasbeen developed for use with Type 6 and finer solderpowder. NC259FPA demonstrates high transferefficiency and precise print definition. The NC259FPAactivator system promotes wetting on all surface finishesresulting in shear values up to 150 gf. NC259FPA residuehas high SIR values and is water clear. NC259FPAprovides high tack force required for mass transferassembly.

3.HANDLING & STORAGE
AIM NC259FPA should be consumed within 24 hours afterpackaging seal is broken. Paste may remain on the printerfor 6-8 hours. Do not add used paste to unused paste. Storeused paste separately; keep unused paste tightly sealedwith internal plug or end cap in place. Please refer toNC259FPA Certificate of Analysis for product specificinformation.

4.CLEANING
Pre-reflow: AIM DJAW-10 effectively removesNC259FPA from stencils while in process. DJAW-10 canbe hand applied or used in under-stencil wipe equipment.DJAW-10 will not dry NC259FPA and will enhancetransfer properties. Do not over-apply DJAW-10. Do notapply DJAW-10 to stencil topside. Isopropanol (IPA) isnot recommended in process but may be used as a finalstencil rinse.

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